Package of light emitting diode and method for manufacturing the same

ABSTRACT

Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

CROSS-REFERENCE FOR RELATED APPLICATIONS

This application is a Continuation of co-pending U.S. patent applicationSer. No. 13/052,684 filed on Mar. 21, 2011, which is a Continuation ofco-pending U.S. patent Application Ser. No. 12/162,105 filed on Jul. 24,2008, which is the national phase of PCT International Application No.PCT/KR2007/000381 filed on Jan. 23, 2007, and which claims priority toApplication No. 10-2006-0008158 filed in the Republic of Korea on Jan.26, 2006. The entire content of all of the above applications is herebyincorporated by reference.

TECHNICAL FIELD

The present invention relates to a package of a light emitting diode,and a method for manufacturing the same.

BACKGROUND ART

An example of a related art light-emitting diode (LED) module is formedas illustrated in FIG. 1. As for the related art LED module of FIG. 1,each of LED chips corresponding to a red LED 2, a green LED 3 and a blueLED 4 respectively is mounted in one independent package. The package ismolded with lens-shaped epoxy to form an individual device as a module.

An example of a related art LED packaging method includes a method offlip-bonding a light-emitting diode chip on a submount of a siliconoptical bench (SIOB), or a method of using a metal core printed circuitboard (MCPCB).

The MCPCB refers to a chip on board (COB) structure where an LED chip isdirectly die-bonded to a printed circuit board (PCB), and then wirebonding is performed thereon for electrical connection.

However, in the case where the MCPCB is used among COB type packagesaccording to the related art, an insulating layer is provided on thethick MCPCB. Here, since a lower metal of the MCPCB is flexible whilehaving a thick thickness, deformation may occur when the MCPCB ispressed, a defective rate thus increases, and inconvenience is caused inhandling the MCPCB during a process operation.

Also, the thick thickness of the lower metal of the MCPCB according tothe related art undesirably obstructs formation of a slim package

Furthermore, since the LED chip does not directly contact a metal plateaccording to the related art, heat generated from the LED chip cannot besufficiently released.

DISCLOSURE OF INVENTION Technical Problem

The present invention provides an LED package and a method formanufacturing the same, which can satisfy demands for a slim package byproviding a surface mounting type LED package capable of solvingdisadvantages, such as a thick MCPCB, of the related art LED package.

Technical Solution

In one embodiment of the present invention, there is provided a packageof a light emitting diode including: a metal plate; a light-emittingdiode chip surface-mounted on the metal plate; an insulating layer onthe metal plate, the insulating layer separated from the light-emittingdiode chip; a lead frame on the insulating layer; a reflective coatinglayer on the lead frame; and a molding material molding thelight-emitting diode chip in a predetermined shape.

In another embodiment of the present invention, there is provided amethod for manufacturing a package of a light-emitting diode, including:forming an insulating layer under a lead frame; forming a light-emittingdiode mounting region in the lead frame and the insulating layer;forming a metal plate under the insulating layer in which thelight-emitting diode mounting region is formed; forming a reflectivecoating layer on the lead frame; surface-mounting a light-emitting diodechip on the metal plate in the mounting region; and performing moldingon the light-emitting diode chip.

In another embodiment, there is provided a package of a light emittingdiode, the package comprising: a base layer including an entire topsurface that is substantially flat; a light emitting diode chip on thebase layer; a lead frame electrically connected to the light emittingdiode chip; and a reflective coating layer comprising titanium oxide,wherein a top surface of the reflective coating layer is substantiallyparallel to a top surface of the base layer, and wherein ends of thereflective coating layer and base layer are aligned with each other.

In another embodiment, there is provided a display device comprising: apackage of a light emitting diode, the package including, a base layerincluding an entire top surface that is substantially flat; a lightemitting diode chip on the base layer; a lead frame electricallyconnected to the light emitting diode chip; and a reflective coatinglayer comprising titanium oxide, wherein a top surface of the reflectivecoating layer is substantially parallel to a top surface of the baselayer, and wherein ends of the reflective coating layer and base layerare aligned with each other.

Advantageous Effects

An LED package and a method for manufacturing the same according to thepresent invention can meet demands for a slim package by using a thinmetal plate and thus considerably reducing a thickness of a PCB.

Also, according to the present invention, since an LED chip is mountedon the metal plate, heat generated from the LED chip is directlyconducted to the metal plate, and thus effective heat release can beachieved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exemplary view of a related art LED package; and

FIGS. 2 through 5 are cross-sectional views of a method formanufacturing an LED package according to an embodiment of the presentinvention.

MODE FOR THE INVENTION

An LED package and a method for manufacturing the same according to anembodiment of the present invention will now be described in detail withreference accompanying drawings.

It will be understood that when a layer (or film) is referred to asbeing ‘on’ or ‘under’ another layer or substrate, it can be directly onor under the other layer or substrate, or intervening layers may also bepresent.

FIGS. 2 through 5 are cross-sectional views of a method formanufacturing an LED package according to an embodiment of the presentinvention.

Referring to FIG. 2, an insulating layer 32 is attached to a lead frame33.

The lead frame 33 is formed of a copper alloy, and may include a circuitwith a predetermined pattern.

Also, the insulating layer 32 may be formed of a glass epoxy-basedmaterial, for example, a flame retardant-4 (FR-4) resin 32. Here, theFR-4 resin 32 is an insulator made of a dielectric resin, and has a highmechanical strength and excellent durability, thereby experiencing justsmall thermal deformation even if the FR-4 resin 32 has a thinthickness. Also, the FR-4 resin 32 is a proper material for formation ofmultiple layers because of its adhesiveness.

When the FR-4 resin 32 is attached to a surface of the lead frame 33using a press or a thermo-compression jig, the FR-4 resin 32 is attachedthereto by heat applied by the press or the thermo-compression jigbecause of the adhesiveness of the FR-4 resin 32.

Referring to FIG. 3, an LED mounting region is formed in the lead frame33 and the FR-4 resin 32.

Specifically, the FR-4 resin 32 and the lead frame 33 that are attachedtogether are punched by a mechanical method, for example, a drillingmachine, to form a space where an LED chip 35 of FIG. 5 is to bemounted.

Here, an attached plate of the FR-4 resin 32 and the lead frame 33 maybe punched to form an LED mounting space having a cylindrical shape or aquadrangle-shaped container.

Instead, a punched section of the FR-4 resin 32 and the lead frame 33may be an inclined surface that is tapered from the lead frame 33 towardthe FR-4 resin 32.

Then, referring to FIG. 3, a metal plate 31 is high-temperaturecompressed and attached to a lower surface of the FR-4 resin 32.

Here, the metal plate 31 may be formed of a metal material havingthermal conductivity, such as aluminum (Al) and siver (Au).

Since the metal plate 31 is thinner than that of the related art, themetal plate 31 contributes to considerably reducing the thickness of thePCB to meet demands for a slim package.

For example, the metal plate 31 has a thickness ranging from about 25 Dto about 75 D, and acts as a heat sink. Also, as the LED chip 35 of FIG.5 is mounted on the metal plate 31, so that the demands for the slimnessof the LED package can be satisfied.

Also, when the metal plate 31 is high-temperature compressed andattached to the lower surface of the FR-4 resin 32, the press or thethereto-compression jig may be used in the same manner as when the FR-4resin 32 and the lead frame 33 are attached together.

Then, referring to FIG. 4, a reflective coating layer 34 is formed on anupper surface of the lead frame 33.

Here, the reflective coating layer 34 may be formed of a material withhigh reflectance in order to improve brightness of light emitted fromthe LED chip 35.

The reflective coating layer 34 may include a white resin includingtitanium oxide and resin as main components and formed by mixing calciumcarbonate, barium sulfate, zinc oxide, or the like.

Also, the reflective coating layer 34 may be formed using a whitepigment besides the white resin.

In the present invention, a screen printing method, not a related artpneumatic dispensing method which has been widely used, is proposed as amethod for applying the white resin for the reflective coating layer 34.

As compared to the related art pneumatic dispensing method, the screenprinting method can apply the white resin to a relatively large areawithin a short period of time, and requires a small equipment investmentcost.

A screen mask (not shown) having a thickness of, for example, 50 D, isformed on a punched portion of the FR-4 resin 32 and the lead frame 33,specifically, on a space in which the LED chip 35 is to be mounted.Thereafter, a portion excluding the screen mask is filled with the whiteresin using a squeeze (not shown).

Specifically, the squeeze moves along an upper surface of the screenmask while rubbing a liquid white resin in a preset direction, so thatthe portion excluding the screen mask can be filled with the liquidwhite resin.

After the portion excluding the screen mask is filled with the liquidwhite resin, the screen mask is removed, and annealing is performed at apreset temperature to cure the white resin, and a surface of the whiteresin is planarized on the same level as the upper surface of the screenmask.

Then, referring to FIG. 5, the LED chip 35 is mounted on the metal plate31 in the mounting space.

The LED chip 35 is mounted on the metal plate 31 using paste (not shown)having thermal conductivity, and the LED chip 35 and the lead frame 33can be electrically connected using a wire 36.

Also, in the present invention, the LED chip may be flip-bonded to asilicon optical bench (SIOB) (not shown), the SIOB to which the LED chipflip-bonded has been flip-bonded may be mounted on the metal plate 31,and electrical connection therebetween may be made using a wire.

After the LED chip 35 is mounted, an epoxy resin, as a molding material37, is injected for molding to a space encompassed by the FR-4 resin 32,the lead frame 33 and the reflective coating layer 34 over the LED chip35.

A surface mounting type LED package formed in the above-described mannercan meet the demands for a slim package since a thin metal layer havinga thickness ranging from about 25 D to 75 D is used, and thus a thinthickness of about 0.6 mm to about 0.4 mm is implemented between thereflective coating layer 34 and the metal plate 31.

Also, according to the present invention, since the LED chip is mountedon the metal plate, heat generated from the LED chip can be directlyconducted to the metal plate, thereby achieving effective heat-release.Industrial Applicability

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present invention. Thus,it is intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

Specifically, although one LED chip is taken as an example fordescribing a surface mounting type LED package according to the presentinvention, the present invention is not limited thereto, and a pluralityof packages each including a plurality of LED chips can be implementedand used for a backlight unit of a liquid crystal display (LCD) device.

What is claimed is:
 1. A package of a light emitting diode, the packagecomprising: a base layer; a semiconductor light emitting diode chip onthe base layer; a lead frame electrically connected to the semiconductorlight emitting diode chip; and a coating layer on the base layer;wherein a bottom surface of the coating layer is positioned higher thana top surface of the semiconductor light emitting diode chip, andwherein a thickness of the coating layer is substantially uniform. 2.The package according to claim 1, wherein the coating layer comprisestitanium oxide and the titanium oxide is substantially uniformly mixedin the coating layer.
 3. The package according to claim 1, wherein endsof the lead frame and coating layer are substantially aligned with eachother.
 4. The package according to claim 1, wherein a topmost surface ofthe coating layer is substantially parallel to the top surface of thebase layer.
 5. The package according to claim 1, wherein a lateral widthof the coating layer is larger than a thickness from a bottommostsurface to the topmost surface of the coating layer.
 6. The packageaccording to claim 1, wherein a shortest lateral width of the coatinglayer is larger than the thickness from the bottommost surface to thetopmost surface of the coating layer.
 7. The package according to claim1, wherein a thickness from a bottommost surface to a topmost surface ofthe coating layer is thinner than a thickness from a bottom surface to atopmost surface of the semiconductor light emitting diode chip.
 8. Thepackage according to claim 1, an entire bottommost surface of thecoating layer is positioned higher than the top surface of thesemiconductor light emitting diode chip.
 9. The package according toclaim 1, wherein the base layer comprises a metal.
 10. The packageaccording to claim 1, wherein the base layer includes an entire topsurface that is substantially flat.
 11. The package according to claim1, further comprising a molding material covering the semiconductorlight emitting diode chip in a predetermined shape.
 12. The packageaccording to claim 1, further comprising an insulating layer on the baselayer, wherein the insulating layer comprises a flame retardant-4 resin.13. The package according to claim 1, wherein the coating layercomprises a white resin.
 14. The package according to claim 1, whereinthe coating layer functions as a reflective layer.
 15. A package of alight emitting diode, the package comprising: a base layer; asemiconductor light emitting diode chip on the base layer; a lead frameelectrically connected to the semiconductor light emitting diode chip;and a coating layer on the base layer; wherein a top surface of thesemiconductor light emitting diode chip is positioned lower than abottom surface of the coating layer, and wherein the coating layercomprises titanium oxide and the titanium oxide is substantiallyuniformly mixed in the coating layer.
 16. The package according to claim15, wherein ends of the lead frame and coating layer are substantiallyaligned with each other.
 17. The package according to claim 15, whereina topmost surface of the coating layer is substantially parallel to thetop surface of the base layer.
 18. The package according to claim 15,wherein a lateral width of the coating layer is larger than a thicknessfrom a bottommost surface to the topmost surface of the coating layer.19. The package according to claim 15, an entire bottommost surface ofthe coating layer is positioned higher than the top surface of thesemiconductor light emitting diode chip.
 20. The package according toclaim 15, wherein a shortest lateral width of the coating layer islarger than the thickness from the bottommost surface to the topmostsurface of the coating layer and wherein a thickness of the coatinglayer is substantially uniform.